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dc.creator | Coombs, Clyde F. | |
dc.date.accessioned | 2021-05-11T16:21:10Z | |
dc.date.available | 2021-05-11T16:21:10Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | http://hdl.handle.net/123456789/13152 | |
dc.description.abstract | PART . 1. Lead-free legislation -- PART. 2. Printed circuit technology drivers -- PART. 3. Materials -- PART. 4. Engineering and design -- PART. 5. High-density interconnection -- PART. 6. Fabrication -- PART. 7. Bare board test -- PART. 8. Assembly -- PART. 9. Solderability technology -- PART. 10. Solder materials and processes -- PART. 11. Nonsolder interconnection -- PART. 12. Quality -- PART. 13. Reliability -- PART. 14. Environmental issues -- PART. 15. Flexible circuits. | es |
dc.language.iso | en | es |
dc.publisher | McGraw-Hill | es |
dc.title | Printed circuits handbook | es |
uade.subject.descriptor | Electrónica | es |
uade.subject.descriptor | Circuitos Electrónicos | es |
uade.subject.descriptor | Manuales | es |
uade.edicion | 6th ed. | es |
uade.identifier.isbn | 0071510796 | es |
academic.materia.codigo | 3.3.136 | es |
academic.materia.nombre | Seminario II | es |