Abstract:
PART . 1. Lead-free legislation -- PART. 2. Printed circuit technology drivers -- PART. 3. Materials -- PART. 4. Engineering and design -- PART. 5. High-density interconnection -- PART. 6. Fabrication -- PART. 7. Bare board test -- PART. 8. Assembly -- PART. 9. Solderability technology -- PART. 10. Solder materials and processes -- PART. 11. Nonsolder interconnection -- PART. 12. Quality -- PART. 13. Reliability -- PART. 14. Environmental issues -- PART. 15. Flexible circuits.